Description: Silver Cooling High Performance Thermal Grease Compound Paste Syringe. For CPU GPU VGA LED Heatsink Fan Chipset Chip Heat Spreader. Low Thermal Resistance / High Conductivity for heat transfer / High Density HY700 series Silver Thermal Grease contains Silver AGO & Silver Powder-High Cooling Performance Material To Improve Thermal Conductivity, Better than Regular Types and Good Partner For CPU / VGA Cooler Compliance with RoHS REACH PFOS requirements Thermal Conductivity: >3.17W/m-k Thermal Resistance: <0.067 C-in2/W Color: Silver Thermal Conductivity: >3.17 Thermal Impendance: <0.067 Specific Gravity: 1.35 Thixotropic Index: 350+/-10 Moment Bore Temperature: -50-280 Operation Temperature: -30-230 Ingredients: Silicone Compounds: 20% Carbon Compounds: 20% Metal Oxide Compounds: 60% Warning: This is not a Glue!! The sole purpose of this paste is to stay moist and provide additional cooling. Warning: If this paste does not provide additional cooling, then there is a problem with either a Circuit Board due to bad capacitors or a short, or is in CPU / GPU Chip due to solder cracking and chip damage because of overheating for significant period of time.
Price: 8.95 USD
Location: Chagrin Falls, Ohio
End Time: 2024-01-20T03:40:52.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Restocking Fee: No
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Compatible Brand: For Acer, For Alienware, For Apple, For ASUS, For Averatec, For Clevo, For Compaq, For Dell, For eMachines, For Everex, For Gateway, For GIGABYTE, For HP, For IBM, For Lenovo, For LG, For Micron, For MSI, For Samsung, For Sony
Thermal Resistance: <0.067 C-in2/W
Color: Silver
Metal Oxide Compounds: 60%
Silicone Compounds: 20%
Material: Silver AGO & Silver Powder-High Cooling Material
Maximum Airflow Volume: All
MPN: SILV30G2X-HY710, GPU CPU VGA LED Heatsink Fan, Chip Chipset Heat Spreader, Pure Silver, Conductive 30g 30 gram, LOT OF TWO X2 2X PIECES
Thermal Conductivity: >3.17W/m-k
Thixotropic Index: 350+/-10
To Fit: VGA, GPU, LED, Heatsink, Chipset, Chip, Chipset - Northbridge, Chipset - Southbridge, GPU Processor
Fan Light Color: Multicolor
Carbon Compounds: 20%
Brand: HALNZIYE
Fan Diameter: all
Type: Thermal Compound
Power Connection: None
Maximum Fan Speed: All
Moment Bore Temperature: -50-280
Packaging: Syringe
Operation Temperature: -30-230
Specific Gravity: 1.35
